BGA Silicone Pad, Insulation Mat, BGA Reballing Stencil Mat, Universal BGA Stencil Magnetic Base, Silicone Tin Planting Pad, Tin Planting Platform for Mobile Phone CPU Chip Soldering BGA Reballing
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BGA Silicone Pad, Insulation Mat, BGA Reballing Stencil Mat, Universal BGA Stencil Magnetic Base, Silicone Tin Planting Pad, Tin Planting Platform for Mobile Phone CPU Chip Soldering BGA Reballing
With strong magnetic adsorption, high temperature resistance, and easy to clean, our BGA Silicone Pad is the ultimate solution for your BGA reballing needs.
BGA Silicone Pad, Insulation Mat, BGA Reballing Stencil Mat, Universal BGA Stencil Magnetic Base, Silicone Tin Planting Pad, Tin Planting Platform for Mobile Phone CPU Chip Soldering BGA Reballing
Ürün No: 133881438

BGA Silicone Pad, Insulation Mat, BGA Reballing Stencil Mat, Universal BGA Stencil Magnetic Base, Silicone Tin Planting Pad, Tin Planting Platform

Ürün No: 133881438

TRY 631

Fiyat Detayları

Excluding Shipping & Custom charges ( Shipping and custom charges will be calculated on checkout )

*All items will import from ABD

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us USA mağazasından ithal edildi
Şimdi sipariş verin ve şu tarihte alın Cumartesi, Ağustos 22
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With strong magnetic adsorption, high temperature resistance, and easy to clean, our BGA Silicone Pad is the ultimate solution for your BGA reballing needs.
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Note: Step Down Voltage Transformer required for using electronics products of ABD store (110-120). Recommended power converters Şimdi Al.

Öne Çıkan Özellikler

Heat Resistance
Designed to withstand high temperatures, this silicone pad ensures durability and longevity during soldering processes, making it perfect for mobile phone CPU chip reballing.
Magnetic Base
The integrated magnetic base keeps BGA components securely in place, enhancing precision and efficiency during rework tasks, thus minimizing the risk of misalignment.
Universal Compatibility
Compatible with various BGA stencil sizes, this versatile mat adapts to different project requirements, providing a reliable solution for multiple mobile device repair applications.

Ürün Detayları

Shop BGA Silicone Pad, Insulation Mat, BGA Reballing Stencil Mat, Universal BGA Stencil Magnetic Base, Silicone Tin Planting Pad, Tin Planting Platform for Mobile Phone CPU Chip Soldering BGA Reballing online at a best price in Türkiye. B0F7XPNSDF
Brand NameDIYPHONE
Included Components1X Silicone Tin Planting Pad
UPC679070215777
Model NumberBGA Silicone Pad
Unit Count1.0 Count
ManufacturerDIYPHONE
BrandDIYPHONE
Item Weight1.5 lbs (680 grams)

Kim Satın Almalı?

Suitable For
  • DIY Enthusiasts

    Ideal for hobbyists who undertake mobile device repairs and require precise soldering solutions.

  • Professional Technicians

    Suitable for technicians engaged in BGA reballing and need a reliable mat for safe component handling.

  • Soldering Students

    Perfect for students learning BGA techniques, offering a controlled workspace for practice and experimentation.

Not Suitable For
  • General Consumers

    Not designed for everyday consumers looking for casual repair solutions without advanced soldering skills.

ÜRÜN AÇIKLAMASI

BGA Silicone Pad, Insulation Mat, BGA Reballing Stencil Mat, Universal BGA Stencil Magnetic Base, Silicone Tin Planting Pad, Tin Planting Platform for Mobile Phone CPU Chip Soldering BGA Reballing

Herhangi bir sorunuz mu var? Bizimle sohbet edin

Müşteri Soruları ve Cevapları

  • Soru: What is a BGA Silicone Pad used for?

    Cevap: A BGA Silicone Pad is primarily used in electronics for reballing, soldering, and assembling surface-mounted devices. Its silicone material provides a non-slip surface, ensuring stability during delicate tasks. For example, if you're working on reballing chips, this pad can hold components in place, preventing any accidental shifts that could lead to poor solder joints.
  • Soru: How does a BGA Reballing Stencil Mat improve my workflow?

    Cevap: The BGA Reballing Stencil Mat is designed to align and secure stencils during the reballing process, facilitating accurate and precise solder paste application. This enhances efficiency and ensures uniformity across all reflowed components. In scenarios where multiple devices are worked on consecutively, using this mat can significantly reduce the time taken for setup and ensure consistent results.
  • Soru: What features should I look for in an Insulation Mat?

    Cevap: When selecting an Insulation Mat, focus on its heat resistance, durability, and non-static properties. These features protect sensitive electronic components from heat and static discharge. An ideal mat will withstand soldering temperatures while providing a cushioned work surface. For instance, if you're working with high-temperature soldering, an effective insulation mat will prevent damage to both your workspace and equipment.
  • Soru: Can I use the Magnetic Base with different BGA Stencils?

    Cevap: Yes, the Universal BGA Stencil Magnetic Base is designed to be versatile, allowing compatibility with various stencil sizes and types. This adaptability enables users to switch stencils without needing multiple bases. It's particularly beneficial for repair technicians who work with different devices daily since it ensures quick setup without compromising on alignment accuracy.
  • Soru: How does a Silicone Tin Planting Pad benefit my soldering projects?

    Cevap: A Silicone Tin Planting Pad provides a heat-resistant surface for tin soldering practices, allowing you to manipulate materials without risk of damage to your workspace. Its flexibility and the non-stick surface make it ideal for reusing solder and moving components. If you're frequently assembling electronic circuits, this pad streamlines your process by ensuring every component stays in place.
  • Soru: Is the BGA Stencil necessary for reballing?

    Cevap: Yes, a BGA Stencil is crucial for achieving precise solder ball placement on BGAs. It ensures that solder paste is applied only where needed, thereby preventing unwanted solder bridges or cold joints. For technicians handling sensitive devices, a stencil optimizes the reballing process and significantly enhances the quality of the final assembly.
  • Soru: What are the advantages of using a BGA Silicone Pad over other materials?

    Cevap: BGA Silicone Pads offer superior non-slip properties and heat resistance compared to mats made of other materials. This reduces the risk of sliding or movement during work, enhancing precision. For professionals who perform intricate soldering tasks, the flexibility and grip provided by a silicone pad make it an ideal choice for steady hands-on projects.
  • Soru: How do I clean and maintain my BGA Silicone Pad?

    Cevap: Cleaning a BGA Silicone Pad typically involves using mild soap and warm water. Ensure you avoid harsh chemicals as they can degrade the silicone. Regular maintenance ensures that the pad remains effective by removing solder residues and other contaminants. If you handle multiple reballing jobs, maintaining cleanliness prevents cross-contamination and ensures every job starts with a pristine workspace.
  • Soru: Are there specific care instructions for my Insulation Mat?

    Cevap: To maintain your Insulation Mat, keep it away from sharp objects and high-temperature tools that might cause damage. Regularly wipe it clean with a damp cloth to remove any flux or solder spills. Keeping the mat in optimal condition prolongs its lifespan and retains its effectiveness during critical soldering tasks, especially in environments where precision is key.
  • Soru: Where can I buy BGA Silicone Pad, Insulation Mat, BGA Reballing Stencil Mat, Universal BGA Stencil Magnetic Base, Silicone Tin Planting Pad, Tin Planting Platform for Turkey?

    Cevap: You can purchase these products on Ubuy, which offers a wide range of electronic repair tools and accessories. Ubuy provides a comprehensive selection of BGA Silicone Pads, Insulation Mats, and other related items, ensuring you have everything you need for your soldering and reballing projects. With easy navigation and detailed product descriptions, finding the right tools for your needs has never been simpler on Ubuy.

DIYPHONE Soldering Stations BGA Silicone Pad Editorial Review

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TRY 631

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En İyi Lojistik Ortaklarımız
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  • dhl
En hızlı sınır ötesi teslimat

Özellikler ve Faydalar

  • Strong magnetic adsorption for stability during use.
  • High temperature resistant and easy to clean design.
  • Features a unique heat dissipation hole preventing bulging.
  • Multi-grid division with three chip slots for diverse requirements.
  • Designed for chip tinning of various thicknesses and specifications.
  • Convenient storage tank design enhances usability.

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